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Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows

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Date of Publication:2022-10-08

Journal:JOURNAL OF MATERIALS SCIENCE MATERIALS IN ELECTRONICS

Affiliation of Author(s):材料科学与工程学院

Volume:29

Issue:6

Page Number:4383-4390

ISSN No.:0957-4522

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