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Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows

Release Time:2022-10-12  Hits:

Date of Publication: 2022-10-08

Journal: JOURNAL OF MATERIALS SCIENCE MATERIALS IN ELECTRONICS

Institution: 材料科学与工程学院

Volume: 29

Issue: 6

Page Number: 4383-4390

ISSN: 0957-4522

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