The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows
Release Time:2022-10-12 Hits:
Date of Publication: 2022-10-03
Journal: 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
Institution: 材料科学与工程学院
Page Number: 1402-1405