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The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows

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Date of Publication:2022-10-03

Journal:2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)

Affiliation of Author(s):材料科学与工程学院

Page Number:1402-1405

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