Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling
Release Time:2022-10-12 Hits:
Date of Publication: 2022-10-08
Journal: INTERMETALLICS
Institution: 机械工程学院
Volume: 93
Page Number: 186-196
ISSN: 0966-9795