First-Principles Study of Ni Additions on Mechanical Properties of Η'-Cu6sn5-Based Intermetallic Compounds
Release Time:2024-10-09 Hits:
Date of Publication: 2024-10-07
Journal: SSRN
ISSN: 1556-5068
Key Words: Atoms; Barrier layers; Biomechanics; Copper compounds; Crystal atomic structure; Elastic moduli; Electronic.structure; First; First principle calculations; Growth of intermetallics; Intermetallics; Intermetallics compounds; layer; Ni; Ni additions; Ni atoms; Nickel; Nickel compounds; P; P layer; principle study; Soldering; Structural properties; Tin compounds