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First-Principles Study of Ni Additions on Mechanical Properties of Η'-Cu6sn5-Based Intermetallic Compounds

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Date of Publication:2024-10-07

Journal:SSRN

ISSN No.:1556-5068

Key Words:Atoms; Barrier layers; Biomechanics; Copper compounds; Crystal atomic structure; Elastic moduli; Electronic.structure; First; First principle calculations; Growth of intermetallics; Intermetallics; Intermetallics compounds; layer; Ni; Ni additions; Ni atoms; Nickel; Nickel compounds; P; P layer; principle study; Soldering; Structural properties; Tin compounds

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