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论文类型：期刊论文

发表时间：2020-08-01

发表刊物：MATERIALS CHARACTERIZATION

收录刊物：SCIE

卷号：166

ISSN号：1044-5803

关键字：Cu6Sn5; (001)Cu; Interface; Grain boundary; Orientation; Soldering

摘要：Orientation-preferred Cu6Sn5 usually offers solder interconnections superior mechanical and physical performances. In this work, morphology and orientation evolutions of Cu6Sn5 at Sn-3.0Ag/(001)Cu interface were investigated in the 300 degrees C-300 degrees C, 230 degrees C-230 degrees C and 300 degrees C-230 degrees C reflow processes. Results demonstrated that the continuous growth of orientation-preferred Cu6Sn5 was realized in the temperature-decreased reflow process of 300 degrees C-230 degrees C and the fraction of 0 degrees boundaries in preferred Cu6Sn5 decreased from 0.81 to 0.60 with time while the fraction of 90 degrees boundaries increased from 0.19 to 0.40; both curvature difference and misorientation angle of grain boundaries should be valued in the growth of preferred Cu6Sn5; the coarsening of preferred Cu6Sn5 includes two methods: coalescence and annexation, induced by the disappearance and migration of grain boundaries respectively. These results are of great significance in the orientation and size control of Cu6Sn5 crystals in 3D packaging.