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论文类型：期刊论文

发表时间：2020-12-01

发表刊物：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

卷号：31

期号：23

页面范围：21335-21341

ISSN号：0957-4522

摘要：Intermetallic compound (IMC) formed on (001) and (111) Cu single crystal has strong orientation and texture characteristics. The special interface morphology and uniform orientation provide a direction for the regulation of IMC growth behavior. In this study, the significant effect of orientation on Cu6Sn5 growth behavior in isothermal aging process was investigated. Synchrotron radiation technology and high pressure air blowing methods were employed to obtain the growth kinetics and the morphology of Cu6Sn5 during the heat preservation stage. The results indicate that scallop-like Cu6Sn5 grains were formed in heat preservation stage. These grains exhibited an abnormal coarsening behavior that their average diameter at a high temperature of 300 degrees C was smaller than that at a low temperature of 250 degrees C after aging for 30 min. Besides, the growth orientation and kinetic controlling factor of these interfacial Cu6Sn5 also changed with the increase of reaction time, which was closely related to the appearance of the abnormal coarsening phenomenon. These results are significant and meaningful to the electronic packaging industry.