|
个人信息Personal Information
副教授
硕士生导师
性别：男
出生日期：1965-06-03
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料无损检测与评价
办公地点：大连理工大学材料馆230房间
联系方式：0411-84707117
电子邮箱：chenjun@dlut.edu.cn
扫描关注
- [121]Ma, Haoran, Kunwar, Anil, Chen, Jun, Qu, Lin, Wang, Yunpeng, Song, Xueguan, Raback, Peter, Haitao, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy[J],MICROELECTRONICS RELIABILITY,2018,83:198-205
- [122]Guo, Bingfeng, Kunwar, Anil, Zhao, Ning, Wang, Yunpeng, Ma, Haitao, Chen, Jun, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints[J],MATERIALS RESEARCH BULLETIN,2018,99:239-248
- [123]Ma, Haoran, Kunwar, Anil, Liu, Zhiyuan, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and coolin...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):4383-4390
- [124]Kunwar, Anil, Guo, Bingfeng, Song, Xueguan, Zhao, Ning, Wang, Yunpeng, Chen, Jun, Ma, Haitao, Shang, Shengyan, Raback, Peter, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Roles of interfacial heat transfer and relative solder height on segregated growth behavior of ...[J],INTERMETALLICS,2018,93:186-196
- [125]郝胜智, 陈军.Surface composite microstructure and improved mechanical property of YG10X cemented carbide induc...[J],International Journal of Refractory Metals & Hard Materials,2018,78:233-239
- [126]Kunwar, Anil, Shang, Shengyan, Raback, Peter, Wang, Yunpeng, Givernaud, Julien, Chen, Jun, Ma, Haitao, Song, Xueguan, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetall...[J],MICROELECTRONICS RELIABILITY,2018,80:55-67
- [127]Ma, Haitao, Haoran, Kunwar, Anil, Shang, Shengyan, Chen, Jun, Huang, Mingliang, Zhao, Ning, Wang, Yunpeng, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders dur...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):602-613
- [128]Guo, Bingfeng, Kunwar, Anil, Jiang, Chengrong, Zhao, Ning, Sun, Junhao, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni su...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):589-601
- [129]Ma, Haoran, Kunwar, Anil, Huang, Ru, Chen, Jun, Wang, Yunpeng, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles d...[J],INTERMETALLICS,2017,90:90-96
- [130]Ma, Haoran, Wang, Yunpeng, Chen, Jun, Kunwar, Anil, Haitao, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and...[J],VACUUM,2017,145:103-111
- [131]Ma, H.R., Wang, Y.P., Chen, J., H.T., Zhao, N..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multip...[A],2017,1402-1405
- [132]Ding, S. S., Jin, S. J., Luo, Z. B., Chen, J., Lin, L., L (reprint author), Dalian Univ Technol, NDT & E Lab, Dalian 116085, Peoples R China..Researches on the Ultrasonic Scattering Attenuation of Carbon Fibre Reinforced Plastics with 2D...[J],ACOUSTICAL PHYSICS,2017,63(4):490-495
- [133]陈军, 杨孟哲, 林莉, 罗忠兵.珠光体组织转变的非线性超声表征[J],无损检测,2017,39(2):1-4
- [134]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Chen, Jun, Zhao, Ning, Wang, Yunpeng, Ma, Haitao.In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/...[A],2017,974-979
- [135]金士杰, 罗忠兵, 陈军, 林莉.Researches on the ultrasonic scattering attenuation of CFRP with 2D real morphology void model[J],Acoustical Physics,2017,63(4):490-495
- [136]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Zhao, Ning, Chen, Jun, Wang, Yunpeng, Ma, Haitao.Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal ...[A],2017,1087-1091
- [137]Ma, H. R., Wang, Y. P., Chen, J., H. T., Zhao, N..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during mult...[A],2017,1402-1405
- [138]王婧云, 张侃, 林莉, 陈军, 叶伟龙.超声相控阵三维可视成像技术的发展与应用概述[J],无损探伤,2015,39(6):32-34
- [139]刘欢, 丁珊珊, 陈军, 金士杰, 罗忠兵, 刘伟华, 林莉.基于波形相关性的CFRP孔隙率统计研究[J],无损探伤,2015,39(3):13-18
- [140]金士杰, 林莉, 陈军, 罗忠兵.Investigations on relationship between porosity and ultrasonic attenuation coefficient in CFRP la...[A],2015