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原位制备TiB<sub>2</sub>增强铜基复合材料的方法和设备

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First Author:WANG Tongmin

Disigner of the Invention:邹存磊,李明宇,David W Wong,张鹏超,caozhiqiang,litingju

Application Number:CN201310519337.9

Authorization Date:2013-10-29

Authorization number:CN103540829A

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