Hits:
First Author:Kang Huijun
Disigner of the Invention:litingju,WANG Tongmin,张玉伟,Chen Diffen,李仁庚,Yiping Lu,jiejinchuan,Yubo ZHANG,caozhiqiang
Authorization number:ZL201710569134.9
Pre One:原位双相颗粒增强铜基复合材料及其制备方法
Next One:析出强化型高强高导CuZr合金及其制备方法