原位双相颗粒增强铜基复合材料
Release Time:2021-01-05 Hits:
First Author: 王同敏
Disigner of the Invention: 邹存磊,康慧君,Chen Diffen,Yiping Lu,接金川,Yubo ZHANG,曹志强,李廷举
Application Number: 2017105983474
Authorization Date: 2017-07-21
Authorization Number: 2017105983474
Release Time:2021-01-05 Hits:
First Author: 王同敏
Disigner of the Invention: 邹存磊,康慧君,Chen Diffen,Yiping Lu,接金川,Yubo ZHANG,曹志强,李廷举
Application Number: 2017105983474
Authorization Date: 2017-07-21
Authorization Number: 2017105983474