Release Time:2021-01-05 Hits:
First Author: 李廷举
Disigner of the Invention: 王同敏,李仁庚,康慧君,陈宗宁,接金川,曹志强,Yiping Lu,Yubo ZHANG
Application Number: CN201510319139.7
Authorization Date: 2015-06-11
Authorization Number: CN105039882A
Prev One:原位双相颗粒增强铜基复合材料及其制备方法
Next One:HIGH-ENTROPY HALF-HEUSLER THERMOELECTRIC MATERIAL WITH LOW LATTICE THERMAL CONDUCTIVITY AND PREPARATION METHOD THEREOF