Hits:
First Author:litingju
Disigner of the Invention:WANG Tongmin,李仁庚,Kang Huijun,陈宗宁,jiejinchuan,caozhiqiang,Yiping Lu,Yubo ZHANG
Application Number:CN201510319139.7
Authorization Date:2015-06-11
Authorization number:CN105039882A
Pre One:原位双相颗粒增强铜基复合材料及其制备方法
Next One:HIGH-ENTROPY HALF-HEUSLER THERMOELECTRIC MATERIAL WITH LOW LATTICE THERMAL CONDUCTIVITY AND PREPARATION METHOD THEREOF
