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原位制备TiB<sub>2</sub>增强铜基复合材料的方法和设备

Release Time:2022-10-20  Hits:

First Author: 王同敏

Disigner of the Invention: 邹存磊,李明宇,wangwei,张鹏超,曹志强,李廷举

Institution: 材料科学与工程学院

Application Number: CN103540829A

Authorization Number: CN201310519337.9

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