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Development of piezoelectric three-dimensional dynamometer for 300mm wafer grinder

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Indexed by:会议论文

Date of Publication:2014-01-01

Included Journals:EI、Scopus

Volume:945-949

Page Number:2017-2020

Abstract:Due to the requirements of on-line detection of grinding force in the grinding process, this paper utilizes the structural characteristics of ultra-precision grinder with double-spindle and single-workstation, and then presents a grinding dynamometer based on piezoelectric effect of quartz crystals. Besides, the grinder dynamometer can measure grinding force in three directions, and the static properties of dynamometer are experimentally tested in a special experiment table. Moreover, the on-line static calibration and the actual grinding experiment of dynamometer installed in the silicon wafer grinder are performed. The results indicate that the grinding dynamometer has satisfactory static properties, that is, the linearity and repeatability are less than 1%, and the crosstalks are also less than 5%. As a result, each indicator has full reached the operating requirements in using of large diameter silicon wafer grinding force measuring. ? (2014) Trans Tech Publications, Switzerland.

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