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金属间化合物填充三维封装垂直通孔及其制备方法

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First Author:Mingliang Huang

Disigner of the Invention:Zhao Ning,张志杰,yangfan,张飞,Zhao Jie,mahaitao

Application Number:CN201510069932.6

Authorization Date:2015-02-09

Authorization number:CN104701283A

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