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一种金属间化合物填充的三维封装垂直通孔及其制备方法

Release Time:2019-10-14  Hits:

First Author: 赵宁

Disigner of the Invention: 钟毅,赵杰,刘嘉希,姚明军,黄斐斐,Mingliang Huang

Application Number: CN201510069933.0

Authorization Date: 2015-02-09

Authorization Number: CN104701249A

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