学位：博士
职称：教授
所在单位：材料科学与工程学院
长期从事金属材料蠕变、组织演化、损伤及寿命预测工作。主持和参加国家自然科学基金重点和面上项目6项，“863”计划课题2项，省部级及企业项目20余项。获国家发明专利5项，发表学术论文200余篇。出版专著“耐热钢持久性能的统计分析及可靠性预测”1部（科学出版社），译著“高温合金”1部，编著1部。获辽宁省教学名师，宝钢教育奖优秀教师奖。辽宁省教学成果一等奖1项，国家本科一流课程、国家精品在线开放课程负责人。Emerald出版社颁发的学术奖“Literati Club Awards for Excellence”，金属学报2009-2015年度优秀论文奖。省部级科技奖励一等奖、二等奖5项。
Interfacial Reaction and Mechanical Properties of Al/Sn-Zn-Ni/Cu Solder Joints
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论文类型：会议论文
发表时间：2013-08-11
收录刊物：SCIE、EI、CPCI-S、Scopus
页面范围：879-882
关键字：Al-Cu solder joint; Sn-Zn-Ni; intermetallic compound; mechanical property; electrochemical corrosion behavior
摘要：Sn-Zn-Ni lead-free solders with different Ni and Zn contents were used to join Al and Cu substrates in the present work. Coarsened Ni3Zn14 and needle-like Zn-rich phases dispersed in the beta-Sn matrixes of the four Sn-Zn-Ni solders. The solders all showed good wettability on Al substrate and the 2# solder was the best. While the wettability on Cu substrate decreased with increasing Zn content. In the Al/Sn-Zn-Ni/Cu solder joints, Cu-Zn intermetallic compounds (IMCs) formed at the solder/Cu interface, while Al-Zn-Sn solid solutions formed at the Al/solder interface. Furthermore, Al3Ni phases dispersed in the bulk solders. The shear tests of the solder joints showed that the failures occurred at the Al/solder interface. This is attributed to the relatively lower bonding strength between Al-Zn-Sn solid solution and Al substrate compared to that between Cu-Zn IMC and Cu substrate. The addition of Zn enhanced the dissolution of Al substrate into the molten solder, which made the Al interface more uneven, further improved the shear strength of Al/Sn-ZnNi/Cu solder joints. The addition of Ni improved the corrosion resistances of the Sn-Zn-Ni solders.
发表时间：2013-08-11
