学位：博士
职称：教授
所在单位：材料科学与工程学院
长期从事金属材料蠕变、组织演化、损伤及寿命预测工作。主持和参加国家自然科学基金重点和面上项目6项，“863”计划课题2项，省部级及企业项目20余项。获国家发明专利5项，发表学术论文200余篇。出版专著“耐热钢持久性能的统计分析及可靠性预测”1部（科学出版社），译著“高温合金”1部，编著1部。获辽宁省教学名师，宝钢教育奖优秀教师奖。辽宁省教学成果一等奖1项，国家本科一流课程、国家精品在线开放课程负责人。Emerald出版社颁发的学术奖“Literati Club Awards for Excellence”，金属学报2009-2015年度优秀论文奖。省部级科技奖励一等奖、二等奖5项。
Effect of Liquid-solid Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu Solder Joint
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论文类型：会议论文
发表时间：2013-08-11
收录刊物：EI、CPCI-S、Scopus
页面范围：1090-1093
关键字：Cu/Sn-9Zn/Cu solder joint; liquid-solid electromigration; interfacial reaction; reverse polarity effect; effective charge number
摘要：The diffusion behavior of Zn atoms and the interfacial reactions in line-type Cu/Sn-9Zn/Cu solder joints undergoing liquid-solid electromigration (L-S EM) were investigated under a current density of 5.0x10(3) A/cm(2) at 230 degrees C. Liquid-solid (L-S) reaction without current at 230 degrees C was also conducted for comparison. It was clearly observed that there existed a reverse polarity effect induced by the Zn atoms migration towards the cathode undergoing L-S EM, i. e., the interfacial intermetallic compounds (IMCs) at the cathode grew continuously and were significantly thicker than those at the anode. At the anode, dissolution and massive spalling of the interfacial Cu-Zn IMCs occurred and the depletion of Zn resulted in the formation of Cu6Sn5 IMC. At the cathode, the interfacial IMCs remained as Cu5Zn8. It was deduced that the effective charge number (Z*) of Zn atoms in both liquid Sn-Zn solder and interfacial Cu-Zn IMCs turned into positive, resulting in the abnormal diffusion behavior of Zn atoms undergoing L-S EM.
发表时间：2013-08-11
