Release Time:2019-03-09 Hits:
First Author: 李晓娜
Disigner of the Invention: 董闯,郑月红
Application Number: CN201310016110.2
Authorization Date: 2013-01-17
Authorization Number: CN103046000A
Prev One:低电阻率高热稳定性的Cu-Ni-Mo合金薄膜及其制备工艺
Next One:一种可调制带隙宽度的Fe-Si-Al系三元非晶薄膜及其制备方法