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低电阻率高热稳定性的Cu-Ni-Mo合金薄膜及其制备工艺

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First Author:lixiaona

Disigner of the Invention:张心怡,朱瑾,wangqing,dongchuang

Application Number:CN201080067138.3

Authorization Date:2010-10-13

Authorization number:CN103237910A

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