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低电阻率高热稳定性的Cu-Ni-Mo合金薄膜及其制备工艺

Release Time:2019-03-09  Hits:

First Author: 李晓娜

Disigner of the Invention: 董闯,王清,朱瑾,张心怡

Application Number: CN201080067138.3

Authorization Date: 2010-10-13

Authorization Number: CN103237910A

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