NAME

刘莹

Paper Publications

COC微流控芯片注塑成型微结构复制度研究
  • Hits:
  • Indexed by:

    期刊论文

  • First Author:

    刘莹

  • Co-author:

    李昊宇,李立刚,高杨,宋满仓

  • Date of Publication:

    2015-03-20

  • Journal:

    塑料工业

  • Included Journals:

    PKU、ISTIC、CSCD

  • Document Type:

    J

  • Volume:

    43

  • Issue:

    3

  • Page Number:

    72-75

  • ISSN No.:

    1005-5770

  • Key Words:

    微流控芯片;微结构塑件;环烯烃共聚物;复制度;注塑成型

  • Abstract:

    环烯烃共聚物(coc)材料具有比聚甲基丙烯酸甲酯(PMMA)更加优良的光学性能、尺寸稳定性与极低的吸水性.以具有微结构的塑件——微流控芯片为研究对象,利用单因素和正交试验研究COC材料注塑成型过程工艺参数对微结构复制度的影响规律并加以分析.结果表明:熔体温度对其微通道的复制度影响最大,是影响微通道复制不完全的主要因素;注射压力和模具温度次之;保压压力和注射速度的影响较小.

Pre One:The Orientation and Achieving Measures of the Training Objective for Mechanical Engineering Major under Engineering Education Accreditation

Next One:Experimental Study on WEDM Machining of PCD and PCBN compacts
Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:

Open time:..
The Last Update Time:..