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Indexed by:期刊论文

Date of Publication:2018-11-01

Journal:MATERIALS RESEARCH EXPRESS

Included Journals:SCIE

Volume:5

Issue:11

ISSN No.:2053-1591

Key Words:shape memory materials; epoxy resin; aromatic diamine; phthalide cardo structure; dynamic mechanical analyzer

Abstract:The novel high-temperature resistant shape memory (SM) materials which were prepared based on diglycidylether of bisphenol A (DGEBA) epoxy resin with a chain-extended aromatic diamine containing phthalide cardo structure (BAPP) as curing agent. The influence of deformation temperature and loading rate on the deformability, and the dependence of shape recovery ratio (R-r) and shape fixity ratio (R-f) on the fixed deformation temperature, imposed deformation load, shape fixity cooling rate and number of cycles were investigated by dynamic mechanical analyzer (DMA) in comparison with these of the common aromatic amine-cured epoxy systems. The deformability, R-r and R-f could be improved markedly by changing the SM programming conditions. The results demonstrate the incorporation of phthalide groups plays an important role on the improvement of SM performance of epoxy networks.