Release Time:2019-03-09 Hits:
First Author: 陆春
Disigner of the Invention: 马克明,陈平,于祺,张利国,高禹,王静
Application Number: CN201410167930.6
Authorization Date: 2014-04-24
Authorization Number: CN105001600A
Prev One:一种热致性液晶聚合物增韧增强的环氧树脂组合物
Next One:含芴基及芳醚键结构的双马来酰亚胺及其制备方法