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多功能电路基板低损耗性能调配与工艺适配性研究

Release Time:2024-10-26  Hits:

Leading Scientist:宗立率

Project Participants:王锦艳,蹇锡高

Project Source:企事业单位委托科技项目

Status:结题

Supported by:China Electronics Technology Group Corporation No. 10 Research Institute

Nature of Project:横向

Date of Project Approval:2021-01-11

Scheduled Completion Time:2021-12-31

Date of Project Initiation:2021-01-11

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