Current position: Home >> Scientific Research >> Research Projects

多功能电路基板低损耗性能调配与工艺适配性研究

Hits:

Leading Scientist:宗立率

Project Participants:Wang Jinyan,Jian Xigao

Supported by:企事业单位委托科技项目

Status:结题

Supported by:中国电子科技集团公司第十研究所

Nature of Project:横向

Date of Project Approval:2021-01-11

Scheduled completion time:2021-12-31

Date of Project Initiation:2021-01-11

Pre One:热塑复合材料油管受力分析及应用研究

Next One:梯度分布纤维