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Date of Publication:2024-11-19

Journal:Chemical Engineering Journal

Volume:500

ISSN No.:1385-8947

Key Words:3-D electronics; Circular waveguides; Computer resource management; Dielectrics property; Dual curing; Ink jet; Ink jet printing; Ink-jet printing; Interpenetration network; Mechanical; Modems; Photo-thermal; Photo-thermal sequential dual-curing; Property; Signal receivers; Thermal printing