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Tough hyperbranched polyaryletherketone-based photosensitive resins bearing excellent dielectric property and thermal resistence

Release Time:2025-07-17  Hits:

Date of Publication: 2024-05-22

Journal: Polymer Testing

Volume: 133

ISSN: 0142-9418

Key Words: 3D printing; Allyl ethers; Blending; Cured films; Dendrimers; Dielectric properties; Dielectrics property; Ethers; Ethylene; Ethylene glycol; Film preparation; Hyperbranched; Hyperbranched polymers; Light sensitive materials; Molecular weight; Photosensitive polyaryletherketone; Photosensitive resins; Photosensitivity; Polyaryletherketone; Polymer blends; Resins; Tensile strength; UV cured; UV-cured film

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