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Tough hyperbranched polyaryletherketone-based photosensitive resins bearing excellent dielectric property and thermal resistence

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Date of Publication:2024-05-22

Journal:Polymer Testing

Volume:133

ISSN No.:0142-9418

Key Words:3D printing; Allyl ethers; Blending; Cured films; Dendrimers; Dielectric properties; Dielectrics property; Ethers; Ethylene; Ethylene glycol; Film preparation; Hyperbranched; Hyperbranched polymers; Light sensitive materials; Molecular weight; Photosensitive polyaryletherketone; Photosensitive resins; Photosensitivity; Polyaryletherketone; Polymer blends; Resins; Tensile strength; UV cured; UV-cured film

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