Release Time:2019-03-09  Hits:

Indexed by: Journal Article

Date of Publication: 2010-12-01

Journal: HIGH PERFORMANCE POLYMERS

Included Journals: Scopus、EI、SCIE

Volume: 22

Issue: 8

Page Number: 930-944

ISSN: 0954-0083

Key Words: Copolyimide; phthalazinone; flexible copper-clad laminate

Abstract: Soluble aromatic polyimides with good comprehensive properties are potential materials for microelectronics. A series of soluble copolyimides containing phthalazinone moieties were prepared from 1,2-dihydro-2-(4-aminophenyl)-4-[4-(4-(aminophenoxyl) phenyl)] (2H) phthalazin-1-one, 4,4'-diaminodiphenyl ether, as comonomers, and appropriate aromatic dianhydrides by one-pot solution polymerization in sulfolane. The corresponding copolyimide films had a good balance in thermal, adhesive and dielectric properties. The resulting copolyimides showed good solubility in polar aprotic solvents such as N-methyl-2-pyrrolidinone (NMP) and N, N-dimethyl acetamide and high thermal stability with glass transition temperatures in the range of 252-266 degrees C and decomposition temperature at 5% weight loss being above 505 degrees C in nitrogen. The copolyimide solutions in NMP were processed into flexible films which exhibited good adhesive property (1.66-2.28 N mm(-1)) and showed a predominantly amorphous nature measured by wide-angle X-ray diffraction. These free-standing films had dielectric constants of 2.3-3.1 (100 kHz) and low water absorption in the range of 0.76-0.93%. These outstanding properties make the obtained copolyimides good candidates for polyimide-based flexible copper-clad laminates.