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涂层导体用Ni4WV合金基带的成分与织构研究

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Indexed by:期刊论文

Date of Publication:2017-01-01

Journal:稀有金属与硬质合金

Included Journals:CSCD

Volume:45

Issue:6

Page Number:31

ISSN No.:1004-0536

Key Words:Ni4WV合金基带; 涂层导体; Ni5W合金基带; 立方织构; 磁性能; 屈服强度

Abstract:通过真空感应熔炼出Ni4WxV(x=2,4,6)合金,采用轧制辅助双轴织构基带技术制备出厚度200mum的合金基带。测量合金基带的磁性能和屈服强
   度;采用X射线衍射技术(XRD)及电子背散射衍射技术(EBSD)分析比较不同成分合金基带的冷轧织构和再结晶织构,并与Ni5W合金基带进行比较,得
   出综合性能更优的成分。结果表明,
   Ni4W2V合金基带综合性能最佳,其屈服强度为150.7MPa,与Ni5W合金基带相当;常温下饱和磁化强度为Ni5W合金基带的55%,立方织构含
   量为56%(<30°),极具研究前景。

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