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An examination of surface stress effects and deformation mechanisms in Al-Cu nanowires

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Indexed by:期刊论文

Date of Publication:2008-06-01

Journal:MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING

Included Journals:SCIE、EI

Volume:16

Issue:4

ISSN No.:0965-0393

Abstract:A molecular dynamics simulation was utilized to study AlCu and AlCu(3) nanowires. The simulation results showed that surface stress can force AlCu nanowires into high-elastic states and induce slip and clusters in AlCu(3) nanowires. Two distinct types of deformation mechanisms were observed. One is that the AlCu nanowires underwent the changes of elastic deformation, amorphous transition, necking and breaking. The other is because the {1 0 1} twinning and crystal region coexist, the calculated tensile curves of AlCu(3) nanowires also show many yield points, and unloading can lead to elastic recovery of 4-9%. It implies that AlCu(3) nanowires are usable even after external shock waves. This work indicates that changing atomic proportions in alloy nanowires can be utilized to control the deformation mechanism upon loading.

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