Release Time:2022-10-19 Hits:
First Author: 王轶农
Disigner of the Invention: 马茹,宋令慧,周德智
Institution: 材料科学与工程学院
Application Number: CN104607466A
Authorization Number: CN201510019525.4
Next One:一种涂层导体用Ni-W合金自生复合基带的制备方法