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论文类型：期刊论文

发表时间：2022-06-29

发表刊物：纳米技术与精密工程

所属单位：机械工程学院

期号：4

页面范围：329-334

ISSN号：1672-6030

摘要：Unlike conventional hot embossing, a new process of injection molding for microfluidic chip was proposed in this paper. The core for molding microchannels was made by using UV-LIGA, and one mold for molding microfluidic chip was designed and manufactured. Experiments indicate that the incomplete replication of microchannels for microfluidic chips is the major defect to the molding. Computer simulation and theoretical analysis show that the stagnant flow of the melt in microchannel is the main reason for molding defects, and a set of visual mold was fabricated to verify this phenomenon. Using the orthogonal experiment method, the influence of different process parameters on the molding process for the incomplete replication was discussed. The results show that mold temperature is the decisive parameter to the replication fidelity of the microchannels; injection rate and melt temperature are the secondary factors; injection pressure is less important than the others, but higher injection pressure is necessary. At last, the injection molding process of microfluidic chips was obtained, and for microchannels with the cross section of 80 μm in width and 50 μm in depth, the replication fidelity was increased from 70% to 90%, which can meet the requirements.

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