Indexed by:期刊论文

Date of Publication:2017-11-01

Journal:INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Included Journals:Scopus、SCIE、EI

Volume:93

Issue:5-8

Page Number:2827-2839

ISSN No.:0268-3768

Key Words:SiCp/Al; Ultrasonically assisted grinding; Conventional grinding; Subsurface damage; Grinding forces

Abstract:Due to the significant difference between the reinforcement grains and matrix phase, the machining of SiC particle-reinforced aluminum composites (SiCp/Al) is difficult and costly, especially for SiCp/Al with volume fraction higher than 50%. Ultrasonically assisted grinding (UAG), which has unique advantages in the machining of both ductile and brittle materials, is a promising solution of the machining of SiCp/Al. This study conducts both UAG and conventional grinding (CG) process on SiCp/Al with an electroplated diamond wheel. The study explores material removal mechanisms involved in UAG in comparison to that in the CG. It also investigates grinding forces, surface integrity, subsurface damage, and wheel wear. The study finds that material removal in grinding of SiCp/Al is dominated by SiC particle fracture that is induced in the grinding process. The ground workpiece is smeared with an aluminum layer, making it difficult to evaluate surface integrity. Compared with CG, UAG of SiCp/Al results in similar surface integrity in terms of surface roughness and subsurface damage, but a much lower grinding force (35-50% lower).