location: Current position: Home >> Scientific Research >> Paper Publications

Development of ultrasonic lapping equipment for small holes finishing

Hits:

Indexed by:会议论文

Date of Publication:2014-09-22

Included Journals:EI、Scopus

Volume:1017

Page Number:812-817

Abstract:Lapping is widely applied to hole surface finishing. However, for small holes of high hardness material, low efficiency and unstable hole surface quality of traditional lapping cannot be ignored. In this paper, the ultrasonic transducer and horn Ctool were designed by the analytical method and the finite element method(FEM). An equipment of ultrasonic lapping for small holes was developed. Vibration performance tests of developed equipment were conducted by using microscope and laser displacement sensor. The result showed that the amplitude of ultrasonic lapping equipment can meet manufacturing demand. The machining performance of the developed ultrasonic lapping equipment was also investigated by comparing the surface quality and material removal rate with traditional lapping. The result showed that the higher material removal rate and better hole surface quality can be obtained by ultrasonic lapping. ? (2014) Trans Tech Publications, Switzerland.

Pre One:Research on elastic-plastic transition and hardening effect for monocrystalline silicon surfaces

Next One:The influence of amplitude on grinding force and surface roughness in ultrasonic assisted grinding of K9 glass