Indexed by:期刊论文
Date of Publication:2019-10-01
Journal:TRIBOLOGY INTERNATIONAL
Included Journals:SCIE、EI
Volume:138
Page Number:307-315
ISSN No.:0301-679X
Key Words:CMP; Pad asperity; Material removal rate; Chemical-mechanical synergy
Abstract:The performance of chemical mechanical polishing (CMP) has been found highly dependent on the pad-work-piece contact status, which is far from theoretical understanding. To this end, a physically-based material removal rate (MRR) model is developed under pad-asperity scale. The theoretical predictions agree well with the experimental results no matter the contact spots distribution is dispersed or concentrated. It is found that the deterioration of MRR is attributed to the continuously reduced number of reacted atoms in each individual contact spot and the inadequate time for chemical reaction between successive contact spots. The present model is expected to facilitate the clarification of the effect of contact status on MRR, and further provide a strategy for CMP mechanisms investigation.
Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates
Title : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
Gender:Male
Alma Mater:西北工业大学
Degree:Doctoral Degree
School/Department:机械工程学院
Discipline:Mechanical Manufacture and Automation. Mechatronic Engineering. Manufacturing Engineering of Aerospace Vehicle
Business Address:机械工程学院7191
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