Indexed by:期刊论文
Date of Publication:2012-02-01
Journal:MATERIALS AND MANUFACTURING PROCESSES
Included Journals:SCIE、EI
Volume:27
Issue:2
Page Number:229-232
ISSN No.:1042-6914
Key Words:Dmage; HgCdTe; Mechanism; Polishing; Removal; Roughness; Slurry; Subsurface; Surface
Abstract:HgCdTe crystals have been accepted as a very important material of infrared detectors, and due to their soft-brittle nature, machining HgCdTe wafers is a challenge in the field of ultraprecision manufacture. In this article, the new polishing slurry is developed, and the new polishing process is employed to polish HgCdTe wafers; the polishing results showed that the polished surface roughness Ra is as small as 0.32 nm, the polished surface is smooth and flat, and the subsurface damage only contains thin amorphous layer with depth of 3 nm. The material removal mechanism during polishing HgCdTe wafers is that HgCdTe react with oxidant and acid in the polishing slurry, and at last, the polished surfaces are covered with HgCdTe and TeO2.
Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates
Title : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
Gender:Male
Alma Mater:西北工业大学
Degree:Doctoral Degree
School/Department:机械工程学院
Discipline:Mechanical Manufacture and Automation. Mechatronic Engineering. Manufacturing Engineering of Aerospace Vehicle
Business Address:机械工程学院7191
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