Indexed by:期刊论文
Date of Publication:2010-06-01
Journal:MATERIALS AND MANUFACTURING PROCESSES
Included Journals:SCIE、EI
Volume:25
Issue:6
Page Number:407-411
ISSN No.:1042-6914
Key Words:CdZnTe; Cleavage plane; Damage; Grinding wheel; Plastic deformation; Subsurface; Surface; Stacking faults
Abstract:The grinding wheels with grit size of #600 and #2000 are employed to grind CdZnTe (110) and (111) planes, and ground surface and subsurface damages were investigated. The experimental results show the damage types are affected by the crystallographic orientation and grit size. When grinding CdZnTe wafers with grit size of #600, due to different angle between the cleavage plane and ground surface, the surface morphology and directions of cracks on the (111) plane are different from those on the (110) plane. When grinding CdZnTe wafers with grit size of #2000, the (111) plane has less plastic deformation than the (110) plane, and there is obvious direction of stacking faults on subsurface.
Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates
Title : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
Gender:Male
Alma Mater:西北工业大学
Degree:Doctoral Degree
School/Department:机械工程学院
Discipline:Mechanical Manufacture and Automation. Mechatronic Engineering. Manufacturing Engineering of Aerospace Vehicle
Business Address:机械工程学院7191
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