Indexed by:期刊论文

Date of Publication:2008-01-01

Journal:INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY

Included Journals:SCIE、EI

Volume:31

Issue:1

Page Number:54-62

ISSN No.:0268-1900

Key Words:chemical mechanical planarisation; kinematic forms; material removal rate; non-uniformity; numerical calculation

Abstract:Chemical Mechanical Polishing (CMP) machine is the main equipment for ultra-precise plane polishing. Based on the Preston equation, the effects of the kinematic form of the carrier and the variables on the material removal rate and the non-uniformity in the main three kinds of chemical mechanical polishers are analysed in this paper. The results may provide a theoretical reference for design of the CMP machine. It is shown that, the kinematic form of the carrier oscillating along the circle arc orbit has a little better uniformity and material removal rate than the other kinematic forms under the same kinematic parameters. In the same kinematic form, with the increase of the slope angle between the locus and the line between the centre of the locus and the centre of the pad, the material removal rates increase and the non-uniformities decrease in the reciprocation mode and the oscillation mode. When the speed of the carrier equals the speed of the pad, the material removal rate and the uniformity is the best.