Current position: Home >> Scientific Research >> Patents

一种半导体晶片及吸盘表面清洗打磨装置

Hits:

First Author:刘建清

Disigner of the Invention:吕鸿明,zhuxianglong,Renke Kang

Authorization number:CN101352828A

Pre One:用于硅片超精密磨床的压电式磨削力测量装置

Next One:一种用于飞机蒙皮镜像铣削的液体静压支撑头
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep