Current position: Home >> Scientific Research >> Patents

修正基片晶面偏差的加工方法及夹具装置

Hits:

First Author:Renke Kang

Disigner of the Invention:liyan,HANG GAO,WU Dongjiang,Dongming Guo

Application Number:CN200810228498.1

Authorization Date:2008-10-31

Authorization number:CN101393856

Pre One:一种晶片磨床的倾角调整装置和方法

Next One:一种螺旋铣孔装置的偏心量检测与控制方法