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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院7191
电子邮箱：kangrk@dlut.edu.cn
Simulation on the ground wafer shape in wafer rotational grinding
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论文类型：期刊论文
发表时间：2011-06-01
发表刊物：Journal of Advanced Manufacturing Systems
收录刊物：EI、Scopus
卷号：10
期号：1
页面范围：175-182
ISSN号：02196867
摘要：During the wafer rotational grinding, the wafer is located on a porous ceramic vacuum chuck, so there are many factors that can affect the wafer shape in the process of the wafer grinding. The wafer shape has an important influence on the surface quality of the silicon wafer and it will be greatly different if the processing parameters are different. So in this paper, based on a mathematics model of the ground wafer shape which has been developed, a simulation system of the wafer shape was made out by using Visual C++ and OpenGL. The relationship between the parameters and the wafer shape was researched and analyzed. The simulation results showed that the roll angle and the pitch angle had the greatest impact on the wafer shape. And the simulation results with different parameters have been compared with each other for the final conclusions. So the results demonstrate the mathematics model is reasonable and the simulation system is of high simulating accuracy, and the ground wafer shape can be predicted very well by it. The research results are significant to logically choose the wafer grinding parameters and effectively control the ground wafer shape. ? 2011 World Scientific Publishing Company.