|
个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院7191
电子邮箱：kangrk@dlut.edu.cn
A novel approach of high-performance grinding using developed diamond wheels
点击次数：
论文类型：期刊论文
发表时间：2017-08-01
发表刊物：INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
收录刊物：SCIE、EI、Scopus
卷号：91
期号：9-12
页面范围：3315-3326
ISSN号：0268-3768
关键字：Si wafer; Diamond wheel; CeO2; Amorphous layer; Transmission electron microscopy
摘要：A novel approach of high-performance grinding is proposed using developed diamond wheels, to obtain minimally damaged surface layer in silicon wafers. For this reason, resin bond diamond wheels are specifically developed with lanthanum oxide (La2O3), magnesium oxide (MgO), and ceria (CeO2) as additives, respectively. The wheels contain grains with a mesh number of 20,000 and a volume fraction of diamond grains of 37.5%. The diamond wheel with ceria additives demonstrates the best grinding performance in terms of surface integrity and roughness. It allows to generate an amorphous surface layer of 43 nm in thickness, without grinding damage beneath in a silicon wafer. This is different from previous reports, in which an amorphous layer is at the top, followed by a damaged crystalline layer underneath induced by a diamond wheel. Below the amorphous layer is the pristine crystalline lattice, which is confirmed using the high-resolution transmission electron microscopy (HRTEM). The ceria wheel results in a surface roughness R (a) of 0.88 nm and a peak-to-valley (PV) value of 8.3 nm over an area of 70 x 50 mu m(2) on a Si wafer at a feed rate of 15 mu m/min.