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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院7191
电子邮箱：kangrk@dlut.edu.cn
Analytical Elastic Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer
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论文类型：期刊论文
发表时间：2018-12-01
发表刊物：JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME
收录刊物：SCIE、Scopus
卷号：140
期号：12
ISSN号：1087-1357
关键字：ultrafine grinding; grain depth-of-cut; cutting tip radius; analytical model; elastic-plastic deformation
摘要：Grain depth-of-cut, which is the predominant factor determining the surface morphology, grinding force, and subsurface damage, has a significant impact on the surface quality of the finished part made of hard and brittle materials. When the existing analytical models are used to predict the gain depth-of-cut in ultra-precision grinding process of silicon wafer, the results obtained become unreasonable due to an extremely shallow grain depth-of-cut, which is inconsistent with the theory of the contact mechanics. In this study, an improved model for analyzing the grain depth-of-cut in ultra-fine rotational grinding is proposed, in which the minimum grain depth-of-cut for chip formation, the equivalent grain cutting tip radius, elastic recovery deformation in cutting process, and the actual number of effective grains are considered in the prediction of the ultrafine rotational grinding of brittle materials. The improved model is validated experimentally and shows higher accuracy than the existing model. Furthermore, the sensitivity of the grain depth-of-cut to three introduced factors is analyzed, presenting the necessity of the consideration of these factors during the prediction of grain depth-of-cut in ultrafine grinding.