|
个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院7191
电子邮箱：kangrk@dlut.edu.cn
A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers
点击次数：
论文类型：期刊论文
发表时间：2016-08-01
发表刊物：INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
收录刊物：SCIE、EI、Scopus
卷号：107
页面范围：1-7
ISSN号：0890-6955
关键字：Grinding; Subsurface damage; Silicon; Residual stress; Load identification
摘要：Subsurface damage (SSD) and grinding damage induced stress (GDIS) result in deformation and strength degradation of a ground silicon wafer. The Stoney equation is widely used as a non-destructive method for finding GDIS in a silicon wafer prepared by the rotational grinding method. However, the basic assumptions of the Stoney equation ignore the detailed information on the GDIS in a ground wafer. In this paper, a new method is proposed for analyzing GDIS distribution in a silicon wafer thinned by grinding. The wafer is diced into small chips for identification of stress state with a load identification method. The results show that the stresses are not independent of the direction as assumed in the Stoney equation, and the ratio of the two principal stresses in the damage layer is approximately 2:3 under the grinding conditions of a #3000 diamond wheel with a spark-out time of 5 s. Moreover, the principal stress direction is obviously aligned with the grinding direction but independent of the crystalline orientation. The SSD is observed with a Transmission Electron Microscope (TEM), which shows numerous plane defects parallel to the {111} planes. It can be deduced from the results that the defects are non-uniformly distributed in the subsurface with their directions in the slip direction of the grinding abrasives. However, the principal stresses at any points have their respective values close to each other. The results of this study are unique and unexpected. (C) 2016 Elsevier Ltd. All rights reserved.