论文成果
On the reaction mechanism of a hydroxyethylidene diphosphonic acid-based electrolyte for electrochemical mechanical polishing of copper
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- 论文类型：期刊论文
- 发表时间：2019-06-01
- 发表刊物：ELECTROCHEMISTRY COMMUNICATIONS
- 收录刊物：SCIE、EI
- 文献类型：J
- 卷号：103
- 页面范围：48-54
- ISSN号：1388-2481
- 关键字：Hydroxyethylidene diphosphonic acid; Electrochemical mechanical
polishing; Copper; Reaction mechanism
- 摘要：In the electrochemical mechanical polishing (ECMP) of copper, hydroxyethylidene diphosphonic acid (HEDP) can work with other water treatment agents to suppress electrolysis and smooth the metal surface. According to Faraday's law, a conventional operating potential lower than 4 V vs. SCE limits the material removal rate (MRR). To solve this problem, potentiodynamic corrosion, potentiostatic corrosion and ECMP experiments were conducted at higher potentials to study the feasibility of the process. The results show that at 6 V vs. SCE, the roughness of a copper wafer was improved, with a MRR of about 0.9 mu m.min(-1), higher than that obtained at the conventional potential. A sample of the barrier film on the copper surface was collected and analyzed by energy dispersive spectroscopy (EDS), Fourier transform infrared spectroscopy (FTIR) and mass spectrometry to investigate the reaction mechanism. It is shown that the copper ions ionized from the working electrode (WE) react with two HEDP molecules to form the coordination compound [CuL2](6-), then K+ combines with [CuL2](6-) to produce the coordination compound [KCuL2](5-).
