康仁科

个人信息Personal Information

教授

博士生导师

硕士生导师

任职 : 国际磨粒技术学会(International Committee of Abrasive Technology, ICAT)委员,中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员,中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员,中国机械工程学会特种加工分会超声加工技术委员会副主任,中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员,中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。

性别:男

毕业院校:西北工业大学

学位:博士

所在单位:机械工程学院

学科:机械制造及其自动化. 机械电子工程. 航空宇航制造工程

办公地点:机械工程学院7191

电子邮箱:kangrk@dlut.edu.cn

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Subsurface crystal lattice deformation machined by ultraprecision grinding of soft-brittle CdZnTe crystals

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论文类型:期刊论文

发表时间:2010-04-01

发表刊物:INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

收录刊物:SCIE、EI、Scopus

卷号:47

期号:9-12,SI

页面范围:1065-1081

ISSN号:0268-3768

关键字:Soft-brittle crystal; Ultraprecision grinding; Subsurface damage; Crystal lattice deformation; CdZnTe

摘要:Cd(0.96)Zn(0.04)Te (111) single crystals were ultraprecisely ground by #1500, #3000, and #5000 diamond grinding wheels, and the corresponding surface roughness Ra is 49.132, 18.746, and 5.762 nm. High-resolution field emission scanning electron microscope and transmission electron microscope were employed to investigate the surface and subsurface damage. After ultraprecision grinding by three kinds of diamond wheels, the subsurface can achieve ultra-low damage layer with thickness of 1-2 nm made of amorphous state material and lattice distortion layer. For the #1500 precision grinding, the subsurface damage is mainly multi-nanocrystal with diameter in the range of 5-20 nm. While for the #3000 precision grinding, the subsurface damage is made of amorphous state material containing nanocrystals with diameter mainly in the range of 2-5 nm, and the bending deformation is mainly conducted through dislocation pleat formation. For #5000 ultraprecision grinding, the subsurface damage is mainly amorphous state material, and nanocrystals with diameter in the range of 2-5 nm enrich adjacent to the ground surface. Moreover, the size of nanocrystal ground by #5000 diamond grinding wheel is mainly 2 nm. Fracture mechanism ground by #5000 diamond grinding wheel firstly turns onto thin amorphous state film, then fracture.