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A comparative study of lapping and grinding induced surface/subsurface damage of silicon wafers and corresponding polishing efficiency

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Indexed by:期刊论文

Date of Publication:2021-01-10

Journal:International Journal of Abrasive Technology

Volume:10

Issue:2

Page Number:122-133

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Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates

Gender:Female

Alma Mater:大连理工大学

Degree:Doctoral Degree

School/Department:机械工程学院

Discipline:Mechanical Manufacture and Automation

Business Address:机械工程学院知方楼5011

Contact Information:guoxg@dlut.edu.cn,15942684586(微信号)

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