Hits:
Date of Publication:2022-10-02
Journal:SENSORS AND ACTUATORS A PHYSICAL
Affiliation of Author(s):电子信息与电气工程学部
Volume:136
Issue:1
Page Number:212-215
ISSN No.:0924-4247
Pre One:Electrostatic bonding of a silicon master to a glass wafer for plastic microchannel fabrication
Next One:Nickel membrane temperature sensor in micro-flow measurement
