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Electrostatic bonding of a silicon master to a glass wafer for plastic microchannel fabrication

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Date of Publication:2022-10-02

Journal:JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Affiliation of Author(s):机械工程学院

Volume:178

Issue:1-3

Page Number:278-282

ISSN No.:0924-0136

Next One:EPMA and XRD study on nickel metal thin film for temperature sensor
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