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论文类型：期刊论文

发表时间：2013-07-01

发表刊物：JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS

收录刊物：SCIE、EI

卷号：12

期号：3

ISSN号：1932-5150

关键字：microelectromechanical systems; micro-tensile testing; axial alignment; piezoresistive; comb vernier

摘要：Specimen alignment is critical for the accuracy and the reliability of micro-tensile testing. A vernier-groove carrier fabricated by bulk micro-machining of silicon is developed. Through the vernier in the carrier the alignment accuracy can be detected, and the groove and the convex stands guarantee rapid alignment and high repeatability. In order to demonstrate the validity of the carrier, a micro-tensile specimen integrated with piezoresistive cells is designed. The specimen can detect axial alignment precision and tensile force simultaneously. The performances of the carrier and the specimen are tested by using a micro-tensile tester. By comparing the measured results of micro-tensile testing with the carrier and without the carrier, it is confirmed that high alignment precision and high repeatability can be obtained by the carrier. For the specimen, the sensitivity coefficient of the piezoresistive cells for tensile force measurement is equal to 0.017 mV/mN. (C) 2013 Society of Photo-Optical Instrumentation Engineers (SPIE)