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论文类型：会议论文

第一作者：Zhang, Mei-juan

合写作者：Chen, Liang,Ya, Bin,Jia, Fei,Zhang, Xing-guo

发表时间：2010-01-01

收录刊物：CPCI-S

页面范围：1886-1889

关键字：Cu-Mg-Te alloy; Mg; Te; tensile strength; electrical conductivity

摘要：This research is relative to the copper alloy with elements of Mg and Te which may affect the tensile strength and electric conductivity. In this research, Mg and Te was added into the copper to smelt, and the microstructure, tensile strength, elongation and conductivity of the copper alloy was tested and analyzed. The results showed that the alloy with elements of trace Mg and Te has advantages of high tensile strength and good elongation, but the electrical conductivity of Cu-Mg-Te alloy with high content of Mg will markedly decrease. So it is better to control the content of Mg with a low value.