潘学民

个人信息Personal Information

副教授

硕士生导师

性别:男

毕业院校:山东大学

学位:博士

所在单位:材料科学与工程学院

学科:材料加工工程. 材料表面工程

联系方式:xmpan@dlut.edu.cn

电子邮箱:xmpan@dlut.edu.cn

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The correlation between the liquid structure and the viscosity of Sn-Cu lead-free solders

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论文类型:会议论文

发表时间:2009-12-26

收录刊物:EI、CPCI-S、Scopus

卷号:97-101

页面范围:679-+

关键字:The liquid structure; viscosity; Sn-Cu solder

摘要:The liquid structure of two lead-free solder Molten alloys, Sn-0.5Cu and Sn-1.8Cu (wt.%), has been examined using X-ray diffraction method. The main peak for liquid structure of Sn-0.5Cu is similar to that of pure Sn. A pre-peak has been found in the low Q part on the structure factor S(Q) of Sn-1.8Cu tested under 320 degrees C, but it disappeared finally when the testing temperature reached 350 degrees C. The both viscosity was measured using a torsional oscillation viscometer. It was found that the anomalous variations of viscosity had a direct relation with the transition of the liquid structure, which is consonant with the results of high temperature X-ray diffraction. The microstructure of the solder matrixes as well as interfacial reaction between liquid solders and Cu substrates was also studied. The results show that particle-like Cu6Sn5 intermetallic compounds (IMCs) emerge in Sn-1.8Cu solder matrix. The IMC layer at Sn-1.8Cu/Cu joint is thicker than that at Sn-0.5Cu/Cti interface. The correlative effect of liquid structure on phase evolution in the solder joints is analyzed.